Accelerated Testing and Failure Diagnosis of High Power Semiconductors using Industrial level Thermal Characterization Methods
September 15, 2014 === === Exploring combined automated power cycling with real time failure-in-progress diagnosis for high power semiconductor components using an industrial thermal characterization test solution. Topics include assessing stack material structure degradation or failures by analysis of the heat conduction path, lifetime prediction (greater than 10K cycles into potentially millions) and verifying thermal properties.

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