Reducing Avionics Packaging Up to 40%
Aired live: December 06, 2017 02:00 PM EST
MiniMRP Leads the Next Generation of Avionics Packaging
The Mini Modular Rack Principle (MiniMRP), standardized in ARINC 836, is a design and modular component solution for avionics systems that distributes avionics throughout the aircraft in smaller, lighter package configurations — reducing avionics packaging space up to 40%!
In this webinar, we will discuss:
- How increased computing power in a smaller package is possible utilizing MiniMRP avionics packaging,
- The role of small-form-factor electronic devices in modular components that work to enable distributed avionics systems,
- How the MiniMRP’s distributed architecture can be easily deployed allowing information collection and distribution around a fiber optic or copper backbone, and
- How new and existing aerospace industry standards can help lower avionics systems cost.
Russ Graves, Business Development for Commercial Aerospace, TE Connectivity
Christian Cavailles, Product Manager, TE Connectivity
Christophe Prel - EMEA Business Development & Optical Flex Products Manager, TE Connectivity
Matt McAlonis, Engineering Manager, TE Connectivity
John McHale, OpenSystems Media