Reducing Avionics Packaging Up to 40%

On-demand webcast:
Aired live: December 06, 2017 02:00 PM EST

MiniMRP Leads the Next Generation of Avionics Packaging

The Mini Modular Rack Principle (MiniMRP), standardized in ARINC 836, is a design and modular component solution for avionics systems that distributes avionics throughout the aircraft in smaller, lighter package configurations — reducing avionics packaging space up to 40%!

In this webinar, we will discuss:
  • How increased computing power in a smaller package is possible utilizing MiniMRP avionics packaging,
  • The role of small-form-factor electronic devices in modular components that work to enable distributed avionics systems,
  • How the MiniMRP’s distributed architecture can be easily deployed allowing information collection and distribution around a fiber optic or copper backbone, and
  • How new and existing aerospace industry standards can help lower avionics systems cost.
Russ Graves, Business Development for Commercial Aerospace, TE Connectivity
Christian Cavailles, Product Manager, TE Connectivity
Christophe Prel - EMEA Business Development & Optical Flex Products Manager, TE Connectivity
Matt McAlonis, Engineering Manager, TE Connectivity

John McHale, OpenSystems Media
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