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DDR4 or HBM2 High Bandwidth Memory: How to Choose Now



Web event: DDR4 or HBM2 High Bandwidth Memory: How to Choose Now
Date: September 12, 2017
Time:09:00 AM PDT
Duration: 60 minutes

High Bandwidth Memory (HBM) is now in volume production in high-end consumer graphics cards. The second version of the standard, HBM2, is set to enable the next generation of high-end graphics processors, High Performance Computing (HPC) and networking chips. While DDR4 is a fast and high capacity DRAM interface offering 200 Gbit/s per DIMM, HBM2 delivers very high memory bandwidth up to 2 Terabits/sec/die stack, with low energy per bit, and low PCB area.

This webinar focuses on the key points to consider when deciding between DDR4 and HBM2 and will explain:
  • Momentum in the market for HBM2
  • The capacity, performance, and power differences between DDR4 and HBM2
  • New requirements when using HBM2, such as system-level architecture, physical design, and test.
  • Benefits and challenges of HBM2’s 2.5D interposer technology and 3D stacking to make thousands of connections between the CPU SoC and the HBM2 device
Audience: SoC designers for server, networking, cloud computing, or high-end graphics applications

Speakers:

Graham Allan
Sr. Product Marketing Manager, Synopsys

Graham Allan joined Synopsys in June 2007. Prior to joining Synopsys, Mr. Allan was with MOSAID Technologies as Director of Marketing for Semiconductor IP. With over 25 years of experience in the memory industry, Mr. Allan has spoken at numerous industry conferences. A significant contributor to the SDRAM, DDR and DDR2 JEDEC memory standards, Mr. Allan currently holds 25 issued patents in the area of memory design.



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