Simulation of Thermal-Structure Interaction

Thursday, July 17th, 2014 - 2:00 p.m. EDTViscoplastic Creep in Soldier Joints


Multiphysics simulation can be used to model thermal-structure interaction and involves coupling structural analysis and heat transfer.

One application includes simulating thermal expansion in order to analyze thermally induced stresses in electronics, MEMS devices, and machineries.

In this webinar we will cover related topics, including thermal and mechanical contact. We will explore features of COMSOL Multiphysics® that are needed for solving thermal-structure interaction problems.

The webinar will include a live demonstration showing how to set up such a problem, and will conclude with a Q&A session.
 

Pictured: Multiphysics simulation of a heating circuit including DC-induced Joule heating, heat transfer, and structural mechanics of the thin resistive layer covering a solid glass plate.

 

Chitra Sethi, Managing Editor, ASME.org Moderator: Chitra Sethi, Managing Editor, ASME.org

Chitra Sethi is the managing editor of ASME.org, where she writes about a wide variety of science and engineering-related topics including aerospace, bioengineering, nanotechnology, robotics, and STEM education. Sethi has over 10 years of experience in technical and online publishing and focuses on emerging technologies and how they impact the society.
 
Kyle C. Koppenhoefer, Principal, ALTASIM Speaker: Kyle C. Koppenhoefer, Principal, AltaSim Technologies

Kyle Koppenhoefer has extensive experience in a wide range of computational mechanics applied to the medical products, automotive, petrochemical and defense industries. He has considerable expertise in advanced finite element procedures and their application to the analysis of structures subjected to multiphysics loading. He obtained his B.S. in Engineering Science and Mechanics, from Virginia Polytechnic Institute and his M.S. and PhD. in Civil Engineering from the University of Illinois.
 
Shankar Krishnan, Applications Engineer, COMSOL Speaker: Shankar Krishnan, Applications Engineer, COMSOL

Shankar Krishnan received a Ph.D. in Aerospace Engineering from University of Minnesota, Twin Cities in 2012. His research focus has been in continuum mechanics and structural mechanics. He is currently working as an Applications Manager at COMSOL.
 

Note: Registration information will be shared with sponsor.

 

 

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