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A Comparative Analysis of Semiconductor Electroplating Bath Additives by CVS and HPLC

Getting fast, accurate measurements on the performance of additives used in semiconductor electroplating baths is of critical importance in ensuring plating quality (uniformity, brightness, and consistency). Cyclic voltammetric stripping (CVS) is a widely used technique to measure the combined effect of additives and by-products on the plating quality of copper and nickel. However, CVS is not able to readily detect components individually, their by-products, or other compounds that are not electrochemically active. Liquid chromatography has been successfully applied to the determination of individual organic additives in acid copper and nickel plating baths.

With the use of faster and more accurate means of determination, products using metal-plated components can be produced with greater consistency and quality, while lowering operational costs, both in time and in materials: the method is relatively fast, requiring little time to operate than a CVS determination, and with a better control of the bath composition, greater operation time and less chemical waste can be realized.

This webinar will provide a comparative analysis of various additives, such as accelerators, levelers, and suppressors, using CVS and liquid chromatography using the Thermo Scientific Dionex UltiMate HPLC systems with charged aerosol and electrochemical detectors.

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Overview


Title: A Comparative Analysis of Semiconductor Electroplating Bath
Additives by CVS and HPLC


Date: Tuesday, June 17, 2014

Time: USA 11:00 am EDT / 8:00 am PDT / 16:00 BST

Duration: 60 minutes including Q&A

Speakers


Paul Voelker
Vertical Marketing Manager, Industrial & Environmental Markets
Thermo Fisher Scientific


Marc Plante, Ph.D.
Senior Applications Scientist
Thermo Fisher Scientific


Stewart F. Fairlie
Senior Process Engineer
Seagate Technologies


Moderator
Jeff Huber

Associate Editor
C&EN



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