Simulation of Thermal-Structure Interaction

Thursday, August 15, 2013 - 2:00 p.m. EDTHeating Circuit

Thermal-Structure Interaction is a class of multiphysics simulation that involves coupling heat transfer and structural analysis. A traditional application includes simulation of the thermal expansion effect to analyze thermal fatigue in machineries, electronics and MEMS devices.

We will also cover related topics such as joule heating, thermal contact and electrical contact. We will explore several different thermal structure interaction problems that highlight features within COMSOL Multiphysics that are critical to solving this class of problem. You will learn how to set up a thermal structure interaction problem in a live demonstration.

John Falcioni, Editor-in-Chief, Mechanical Engineering Moderator: John G. Falcioni, Editor-in-Chief, Mechanical Engineering

John G. Falcioni is Editor-in-Chief and Publisher of Mechanical Engineering, the flagship publication of the American Society of Mechanical Engineers.

Kyle C. Koppenhoefer, Principal, ALTASIM Speaker: Kyle C. Koppenhoefer, Principal, ALTASIM

Kyle Koppenhoefer obtained a PhD from the University of Illinois, Urbana-Champaign. His work in advanced finite element procedures and their application to the analysis of structures subjected to multiphysics loading has been applied to medical products, automotive, petrochemical and defense industries.

Kyle C. Koppenhoefer, Principal, ALTASIM Speaker: Supratik Datta, Applications Manager, COMSOL

Supratik Datta holds a Ph.D. in Aerospace Engineering from University of Maryland, College Park. He has been involved in research related to cryogenics in biomedical application, damage detection in composites, phase transformation in ferrous alloys and design and non-linear modeling of smart structures.

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