Heat Transfer in Solid and Fluids

Thursday, March 7, 2013 • 2:00 PM Eastern Standard Time

This webinar will examine how heat transfer couples with other physics and how simulation is used to verify and optimize your designs. We will start with an introduction to multiphysics modeling by showing examples of heat transfer simulations involving conduction, convection, and radiation; structural thermal expansion; and electromagnetic, chemical, and acoustic heating. Dr. Jon Ebert, Director at SC Solutions and guest speaker for this event, will discuss his modeling activity encompassing a broad range of heat transfer-related applications. Dr.  Ebert will also show how to model heat transfer applications and how to use simulation results for real-time feedback control of temperature in manufacturing processes. The webinar will end with a Q&A session.

 
John Falcioni Moderator: John Falcioni, Editor-in-Chief, Mechanical Engineering

John G. Falcioni is Editor-in-Chief and Publisher of Mechanical Engineering, the flagship publication of the American Society of Mechanical Engineers.

Jon Ebert Speaker: Jon Ebert, Director, SC Solutions, Inc.

Jon Ebert received his Ph.D. in Mechanical Engineering from Stanford University. He has worked as a consultant in the Semiconductor and Materials processing area for 22 years, and for the past 16 years as a Director at SC Solutions, Inc. in the Systems and Control Division. His background is primarily in thermosciences and process control.

John Dunec Speaker: John Dunec, Vice President of Sales, NW US, COMSOL, Inc.

John Dunec received his PhD from Stanford University in 1983. John has over 25 years of experience in product analysis and development. He started his career at IBM, was successful at an early multiphysics startup, and then ran a product development consulting firm. As a consultant, he was one of COMSOL’s first US customers and is now VP of Sales, North West US and Manager of the Palo Alto office. He has been teaching COMSOL courses throughout the US since 2003.
 
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