Heat Transfer in Solids and Fluids
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Thursday, January 16, 2014 - 2:00 p.m. ESTNecking Collage



This webinar demonstrates how to use multiphysics simulation to model heat transfer to optimize and verify the performance of your designs.

A demo in the COMSOL environment features a multiphysics model of a heat sink with temperature-dependent material properties that shows you how to couple heat transfer to other physics. Examples are shown throughout that explain how to simulate different aspects of heat transfer, including convection, conduction, and radiation; chemical, electromagnetic, and acoustic heating; and structural thermal expansion.

The webinar concludes with a Q&A session.

Multiphysics simulation of an aluminum heat sink for cooling of components in electronic circuits. Heat transfer by conduction, convection and radiation are taken into account where all material properties are temperature-dependent.

John Falcioni, Editor-in-Chief, Mechanical Engineering Moderator: John G. Falcioni, Editor-in-Chief, MECHANICAL ENGINEERING

John G. Falcioni is Editor-in-Chief and Publisher of Mechanical Engineering, the flagship publication of the American Society of Mechanical Engineers.
 
Nicolas Huc, Product Manager Heat Transfer, COMSOL Speaker: Nicolas Huc, Product Manager Heat Transfer, COMSOL

Nicolas Huc received his Ph.D. from the University Joseph Fourier in Grenoble, France and joined COMSOL in 2004. He leads the development team in France and is responsible for development of heat transfer interfaces in COMSOL Multiphysics.
 
Jennifer Segui, Technical Marketing Engineer, COMSOL

Speaker: Jennifer Segui, Technical Marketing Engineer, COMSOL

Jennifer Segui is a Technical Marketing Engineer at COMSOL in Burlington, MA. Before joining COMSOL, her research focused on the design and characterization of electronic devices including solar cells and digital x-ray detectors for medical imaging. She received her master’s degree in Biomedical Engineering specializing in Medical Physics from SUNY-Stony Brook.


Note: Registration information will be shared with sponsor.

 

 

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