Tech Insider: Acoustics Simulation in Microphones, Mobile Devices and Hearing aids
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 This presentation will be available to audience members until November 01, 2014 at 06:00 PM Eastern Daylight Time.
Thursday, October 3, 2013  2:00 PM Eastern Daylight Time
Thermal conduction and viscous losses are important considerations in modeling the acoustic performance of small devices. Introducing thermoacoustic effects into a simulation properly accounts for these frequency-dependent losses. Learn how to model small acoustic devices including mobile devices, hearing aids, and microphones using COMSOL Multiphysics. This webinar features several example models and strategies for efficient simulation including coupling thermoacoustics to lumped models and classical pressure acoustics. The webinar will conclude with a 15-minute Q&A session.
Moderator: Dexter Johnson, Contributing editor for IEEE Spectrum’s Tech Talk
Speaker: Mads J. Herring Jensen, PhD, Technical Product Manager, Acoustics, COMSOL
Speaker: John Dunec, VP of Sales, NW US, COMSOL
Sponsored by:  
Attendance is free. To access the event please register.
Note: Registration information will be shared with sponsor.

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