Tablets are The Sign of the Times
Tablet computers are a great option for small digital signage. Everything you need is built in – media player, display, and wireless capabilities. See how you can use these machines to engage customers with interactive experiences.
Embedded Dual-Band GSM Antenna Design
This application note illustrates how CST MICROWAVE STUDIO® (CST MWS), Antenna Magus and Optenni Lab can be used in combination to improve an existing GSM tracking device application. The requirement was to replace an existing “off-the-shelf” antenna on a GSM tracking device with an embedded, integrated antenna in order to reduce manufacturing and component costs.
Selecting Common Mode Filter Chokes for High Speed Data Interfaces
High speed data interfaces like USB, HDMI, Wi-Fi, IEEE1394/FireWire and LVDS require careful consideration to ensure reliable communication that is free of disruptive EMI. Of the many tools at the designer’s disposal like trace routing, termination and component placement, the common mode filter choke remains one of the most powerful. This application note discusses the benefits of using common mode chokes and reviews the performance characteristics associated with their proper application.
Logistics Risk Management in the Transformer Industry
Transformers often are shipped thousands of miles, involving multiple handoffs, and more than a dozen logistics teams before they are installed. With an impact threshold of about 2.5g, damage isn’t always evident. Hidden damage may trigger an event cascade that causes catastrophic failure long after installation. Impact monitors reduce that potential by recording the impact and duration of potentially damaging events. Download the white paper to learn more.
Taking a Gas Turbine out for a Spin
Tests of gas turbine engines and other rotating machines often occur under extreme conditions: high rotational rates, pressure, and temperature. Advanced signal conditioning techniques ensure accurate measurements, eliminating electrostatic noise and compensating for resistance and temperature variations. This whitepaper examines the advantages of balanced constant current excitation—using a pair of matched current sources to excite a transducer and a differential amplifier to measure gage voltage—for dynamic strain measurements.
To Succeed, Control Your Speed
When it comes to large rotating equipment, conserving energy means decreasing operation costs. Find out how medium-voltage variable frequency drives (VFDs) can help you save big on installation, operating and maintenance costs.
Adding Reliability and Availability to Your Manufacturing Process
Reliability and availability of medium-voltage equipment is critical in any application. See how SINAMICS PERFECT HARMONY VFDs are designed to deliver uptime, all the time.
AR Electromagnetic Safety Products Application Note
AR RF/Microwave’s line of electromagnetic safety products are designed to measure exposure levels of a variety of products and systems such as Industrial Ovens, RF Medical Devices, Power Plants, Ground Transport Systems, Wireless Telecommunications, Base Stations and more. The demand for these products is rapidly increasing with companies and the public becoming more aware that human exposure to electromagnetic fields should be measured and controlled. Download the application note for a full overview.
Control Design Guide for Next-Generation Smart Machines
Download the Control Design Guide for Smart Machines to learn how NI CompactRIO empowers smart machine design and intelligent factories.
In-House vs. Outsource
Whether it's design validation, functional testing or faster launch of new products - top management seldom needs to be convinced of the benefits of 3D printing. Yet most businesses still outsource 3D modeling, with the most prevalent claim being financial - "our prototyping volume does not justify an expensive in-house 3D printer." What many companies do not realize is that the 3D printing industry has advanced dramatically; and the availability of a new breed of high-quality 3D printers at affordable prices now discredits the "too costly" argument. In this white paper, learn how in-house 3D printing capabilities provide a range of operational and business benefits that translate into real bottom line advantages.
Four Factors to Avoid Damaging Wearable Brands
As more devices and wearable technology uses location tracking from GPS, BeiDou and other global navigation satellite systems (GNSSs), design teams and engineers must ensure it performs quickly and accurately to meets users’ needs in all conditions.

Without good testing, end users will discover problems, such as poor accuracy, slow response, or signal loss; and will share their frustration with friends and colleagues.

This eBook will show you how to create a test environment for the positioning elements of a wearable devices that will allow you to bring products to market faster, reduce the risk of faults in the field, and safeguard against problems with interference.
Integrating GPS into consumer products
Engineers tasked with integrating positioning technologies into products are now commonly required to define and implement new regimes to ensure that the chosen GPS, GNSS and hybrid positioning systems function to ever tighter specifications. This can be challenging. Test equipment manufacturers publish specification data, often with little interpretation to give meaning to the numbers. But for device manufacturers, the development consequences of choosing the wrong test equipment—and running ineffective or inconsistent tests—can be severe. This white paper will give engineers clarity, summarizing the key areas and outlining some common pitfalls surrounding testing procedures and apparatus.
Replacing Electrolytics with High-Value MLCCs in Power Supply Applications
This paper describes the material science behind TAIYO YUDEN’s advanced MLCC products. It also presents comparative performance and price data to show how these ceramic capacitors afford significant benefits over polymer capacitors.
Maximize Value from IoT Data
The Internet of Things has opened up a new world of data sharing. This paper shows how companies can turn that data into valuable business insights.
Simplify IoT Integration with Edge Management Middlewear
This paper shows how the Wind River Edge Management System helps developers build vertical-specific IoT solutions that successfully integrate enterprise IT systems and edge devices.
Accelerating Communications Infrastructure with the Intel® Xeon® Processor E5-2600 v3 Product Family
The latest Intel® Xeon® processors deliver exceptional networking performance. Learn how the latest AdvancedTCA* blades can deploy this performance in SDN, NFV, and more.
The Role of DPI in NFV
NFV (Network Functions Virtualization) environments present challenges for DPI (Deep Packet Inspection). Here's how a reference architecture overcomes the challenges - and how you can use the same techniques.
ASIC Design Made Cost Effective with Low Cost Tools and Masks
For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs.
Benchmarking Low Power
Read our informative article on the common methodology and various benchmarks that are frequently used in the industry to show microcontroller (MCU) power performance.
Four Ways 3D Printing is Shaping Product Design and Manufacturing
Product engineers and tooling manufacturers have much to gain from 3D printing: By generating low-cost physical prototypes early in the design process, they can check form, fit and function; gauge customer response; and compare design iterations without commitment. It’s even possible to quickly craft end-use parts, customized for a particular job. And no longer are manufacturing professionals limited by 3D printers that are too big, unfit for the office environment, and prohibitively expensive. Today, affordable, compact, office-friendly units are moving 3D printing capabilities to the desktop and dramatically expanding the availability of high-quality prototypes and parts.
Power and the Industrial Internet of Things
The Internet of Things (IoT) is coming to the energy and manufacturing industries. The world’s energy infrastructure, in particular, is undergoing a user-centered, software-driven, digital transformation—a change from the material and mechanical innovations that have sparked changes in other industries and other times.
Connect Legacy Equipment with Internet of Things (IoT) Gateways
Extracting valuable data from existing infrastructure is a key challenge for the IoT. Find out how a simple IoT gateway can help you gather a wide range of analog and digital data from legacy equipment.
Go Small with Intel® Quark SoC X1000
Based on Intel's smallest core, the Intel® Quark processor is a low-power but highly-integrated solution for the Internet of Things (IoT). See how you can deploy it in industrial, transportation, and energy applications.
Analysing the Demand — Supply Dynamics of the Australian South Eastern Gas Market Using PLEXOS®
The demand - supply interactions of the eastern Australian gas market is analysed in order to establish any potential risk of gas shortage in the medium - long term. Employing a model developed through the new gas module in PLEXOS®, an analysis of the market is carried out from 2013 — 2024 in order to understand LNG effects on the market and also identify any potential supply shortfalls looming ahead.
Flexible Power Generation and Interconnection Capacity needs of the Italian Power System Using PLEXOS® LT Plan
The SAPP was formed in 1995 and as of 2013 had sixteen participating members transforming from an initial co-operative electricity market into a competitive one in 2009. The SAPP has been significantly constrained for generation and transmission capacity in the last decade having a significant effect on the volume of electricity trade. A regional level SAPP model has been developed in PLEXOS including a representation of load profiles, existing transmission interconnectors and existing major generators. The case study reveals that existing energy imbalances in SAPP countries can be significantly reduced if interconnectors are unconstrained allowing for optimal trade of electricity between SAPP nations.
Assessing Electrical Transmission Constraints for the Southern African Power Pool (SAPP) in PLEXOS®
Many consumer products communicate with each other over broadband networks. From television to fiber transmission networks, the bandwidth of data communication is increasing, and the integrity of RF signals has become a major design concern. This paper demonstrates how different inductors can be used for RF isolation in a range of circuits, from relatively narrow band applications like portable devices up to broadband networks for data distribution.
Solving RF Isolation Issues with RF Inductors
Many consumer products communicate with each other over broadband networks. From television to fiber transmission networks, the bandwidth of data communication is increasing, and the integrity of RF signals has become a major design concern. This paper demonstrates how different inductors can be used for RF isolation in a range of circuits, from relatively narrow band applications like portable devices up to broadband networks for data distribution.
Electric Vehicles and the Challenge of Convergence
This paper explores how the automotive and utilities industries can harness "system of systems" concepts and systems engineering methodologies to converge their engineering capabilities and meet the challenge of developing a viable infrastructure for electric vehicles (EVs).
New Automotive RF Immunity Testing Poster by AR RF/Microwave
AR RF/Microwave Instrumentation's latest poster, although targeted for the automotive industry, illustrates the wide array of AR EMC systems and products, once again demonstrating AR's EMC capabilities. Register to download an electronic copy, or request a hard copy of this easy to use quick reference guide.
Ten Steps to Better Requirements Management
Requirements definition and management is recognized as a necessary step for the successful delivery of systems and software projects; the discipline is also required by standards, regulations and quality improvement initiatives like Capability Maturity Model Integration (CMMI).
CIC Agile Case Study: European Embedded Technology Provider
This case study examines the adoption of agile processes within a European embedded technology provider, focusing on the challenges encountered in deploying agile beyond beyond software development activities.
Modeling Toll Tag Reader Electromagnetic Coupling to Locate Lane Cross-Read Error Potential
The electromagnetic coupling between an ISM band (902-928 MHz) highway toll tag and a collection gateway reader is simulated using a high frequency asymptotic EM analysis technique. The study illustrates how traffic congestion in the toll gateway leads to cross-lane toll reads due to additional EM scattering and multipath effects. Simulations are provided by Delcross Savant--an asymptotic EM analysis package aimed at simulating installed antenna performance and antenna coupling scenarios in very electrically large and complex environments.
Accelerated Testing and Failure Diagnosis of High Power Semiconductors using Industrial level Thermal Characterization Methods
Exploring combined automated power cycling with real time failure-in-progress diagnosis for high power semiconductor components using an industrial thermal characterization test solution. Topics include assessing stack material structure degradation or failures by analysis of the heat conduction path, lifetime prediction (>10K cycles into potentially millions) and verifying thermal properties.
7 Key Considerations For Effective Chip-Package Thermal Co-Design
Chip-package co-design is important for several reasons. Designing a large high power die, e.g. a System-on-Chip (SoC) without considering how to get the heat out is likely to lead to problems later on, resulting in a sub-optimal packaging solution from cost, size, weight and performance perspectives. Historically IC design has considered the die temperature to be uniform. This is no longer a valid assumption in many cases. Heating due to current leakage, which is temperature dependent, is making power dissipation less uniform, and the use of thinner die, now well below 50µm, has reduced the heat spreading capability of the die itself. Both of these effects contribute to greater on-die temperature variation.
Reliability in Networking and Telecom Systems – Managing Excessive Heat
The main source of heat in electronic equipment is their semiconductor chips, and the temperature sensitivities of these chips presents a challenge in designing cooling solutions. Overheating causes the chips to prematurely fail–and failure of only one chip can disable the entire equipment, the higher the chip temperature, the earlier and more certain the failure. As functionality has increased, the associated heat dissipation has escalated to the extent that it is recognized as a potential limitation on the pace of electronics systems development. Appropriate cooling strategies are needed to prevent overheating, and failure, of critical components.
How to Charge Supercapacitor Banks for Energy Storage
This article from Intersil addresses the challenges related to charging supercapacitors, and shows power system designers how to evaluate and select the best system configuration for backup energy storage.
Building Blocks for the Internet of Things
This article illustrates how Intel and the 250+ Alliance member companies ate delivering the performance, connectivity, manageability, and security solutions that developers need to unleash the loT. We examine key building blocks, including the recently unveiled Intel- Quark SoC X1000, the Intel- AtomTM processor E3800 product family (formerly codenamed "Bay Trail"), and a new family of intelligent gateway solutions featuring integrated software from McAfee and Wind River. We also highlight examples of loT applications in markets like Industrial automation and energy distribution.
Bring Legacy Equipment into the Connected Factory
Connecting old equipment to the IoT can be a major challenge. Find out how IoT gateways and cloud platforms from the Alliance simplify the task.
Selecting the Best Inductor for Your DC-DC Converter
Selecting the proper inductor for DC-DC converter applications requires a good understanding of inductor performance parameters and of how desired in-circuit performance relates to the information available in supplier data sheets. This article defines the key power inductor specification parameters and helps the engineer identify and understand the performance ratings for each.
802.11 Wi-Fi Physical Layer and Transmitter Measurements
New! Wi-Fi Standards Poster

Get Your Personal Wi-Fi Poster for your Desk or Lab!

Get access to this new educational Wi-Fi standards poster. All aspects of 802.11 Wi-Fi physical layer and transmitter measurements are covered:
  • Channel allocation
  • Spectral shape
  • Packet information
  • Data rates
  • Modulation types
  • Transmitter measurements
  • All 802.11 standards are featured. Including the new 802.11ac!
Hurry, download your Wi-Fi standards poster today.
Divide and Conquer: Hierarchical DFT for SoC Designs
Large System on Chip (SoC) designs present many challenges to all design disciplines, including design-for-test (DFT). By taking a divide-and-conquer approach to test, significant savings in tool runtime and memory consumption can be realized. This whitepaper describes the basic components of a hierarchical DFT methodology, the benefits that it provides, and the tool automation that is available through Mentor's Tessent tool suite.
Root Cause Deconvolution - The Next Step in Diagnosis Resolution Improvement
Scan logic diagnosis turns failing test cycles into valuable data and is an established method for digital semiconductor defect localization. The advent of layout-aware scan diagnosis represented a dramatic advance in diagnosis technology because it reduces suspect area by up to 85% and identifies physical net segments rather than entire logic nets. The defect classifications provided by layout-aware diagnosis make diagnosis an effective tool not just for localization of defects but also for yield analysis.
Recruit or Retain Report
As companies are forced to do more with less, have new hire expectations changed? Has this mounting pressure put developing current employees on the back burner? Our survey seeks to find out the importance of engaging, developing and investing in your current qualified workforce.
Podcast: Turning data into knowledge for competitive advantage - How to deliver smarter product development
This podcast outlines how knowledge about customers, operations, and your development process can help you achieve smarter product development.
Objet500 Connex3: How to Maximize Multi-Material and Color Possibilities
For the first time, print true-to-life 3D models you've been waiting for. Apply vibrant solid and transparent colors - or combine color with flexible and rigid pieces all in the same build. With so much functionality, what will you design next? To see what's possible with Objet500 Connex3 download this white paper today.
Improve Logic Test with a Hybrid ATPG/BIST Solution
Two test strategies are used to test virtually all IC logic—automatic test pattern generation (ATPG) with test pattern compression, and logic built-in self-test (BIST). For many years, there was a passionate debate between some DFT practitioners about which is the best test method— ATPG or BIST. ATPG has been dominant for years, and is now used for full-chip test across the electronics industry. However, the use of logic BIST has increased lately with the higher demand to be able to test chips in a system or with limited tester interface, such as for burn-in test, board test, and MCM (multi-chip module). Recently, the differences between the two test approaches have slightly blurred, and now DFT implementations can efficiently share logic between the two approaches. Thus, for some designs, the decision isn't between using ATPG or logic BIST but to how to use them together. This paper will describe how ATPG and logic BIST work, explain the differences between them, and offer guidelines on when to use one, the other, or a mixture of both.
Ultimate Guide to Testing WLAN 802.11
As WLAN standards evolve to support demands for more bandwidth there is a lot to learn and understand. Stay current with today's latest Wi-Fi standards including the new 802.11ac. In this new guide, learn about all the 802.11 standards, their PHY layer characteristics and their testing requirements. Everything from channel allocations, to spectral masks and country allocations are covered. It's the ultimate guide to understanding and testing for 802.11.
HPEC Proof-of-Concept Delivers Breakthrough Bandwidth
A new VPX proof-of-concept delivers 40 Gigabit Ethernet (GbE) equivalent bandwidth via PCI Express 3.0. See how it can help you to break through performance barriers.
Building Blocks for the Smart Grid
Intel, Dell, National Instruments, and OSIsoft have created a synchrophasor design that collects and analyzes power data. Learn how it deploys secure, seamless communications.
Understanding Natural Gas Fuel Reliability for Backup Power
Reliability of fuel supply tends to be of great concern for authorities having jurisdiction (AHJs). On-site fuel (most often diesel) is typically required for life-safety applications, and many mission-critical applications like 911 call centers specify it because it is perceived to be more reliable. Nonetheless, maintenance issues and delivery concerns of diesel fuel in an emergency, combined with the reliability and cost-effectiveness of natural gas, must be considered in a standby power system. NFPA and NEC offer provisions for the use of natural gas in standby power applications that had previously been the clear domain of diesel-fueled systems. There are also many ways to work with the AHJ to clear the way for the use of gaseous fuel in a standby power system.
Physical Design Reuse: How to Leverage Corporate IP to Increase Efficiency in PCB Design
Development time for your next PCB design project is always less than that of your last project. To stay competitive, companies constantly examine their design processes to find ways of decreasing product development time. This paper examines how PADS (personal automated design system) can reduce PCB design time through physical design reuse (PDR). It illustrates various uses for PDR, shows the positive effects of PDR on design time reduction, and highlights key reasons why PADS outperforms the competition.
Pattern Matching: Blueprints for Further Success
Design patterns have a wide variety of applications in the design, verification and test flows of IC development. From significantly reducing rule deck complexity to simplifying the task of avoiding known yield detractors to enhancing workflows such as design rule waiver recognition, pattern matching has become a useful tool throughout design, verification, and test process. Learn how Calibre® Pattern Matching software can help you implement automated pattern capture and pattern matching in your various IC flows for maximum success at emerging process nodes.
The Future of Machines
High speeds and operating machines running at maximum load are increasing the wear and tear on mechanical components. Learn how machine builders address these challenges and read about the latest technologies for machine monitoring. Read the white paper from National Instruments.
IBM Requirements management for smart products Resources
If you are new to requirements management, or wish to improve your existing requirements management process, this e-Kit will provide you with useful guidance, resources and advice.
Achieving sustainable requirements across the supply chain with Rational DOORS
In this webcast you will learn how your investment in requirements can be sustained across your tool chain, supply-chain and your future requirements management needs.
Agile in the Embedded World
Learn how Agile encourages developers to be more iterative, team-oriented, self-improving and customer focused.
Materials Matter: The Material Selection Process
Fact is, materials selection gets complicated. The relationship between the internal structure of a material and its performance properties is not always clear. To shed light on the situation, this white paper helps guide you through the process of determining key performance parameters, from impact resistance and stress cracking to yield and tensile strength.
Additive Manufacturing Trends in Aerospace: Leading the Way
The aerospave industry has long been looked to as a leader in predicting manufacturing trends. To learn how organizations such as NASA & Leptron are using additive manufacturing in all cycles of production, from design concept to near-end-of-life repairs, download this whitepaper now.
Measuring Current and Making Power Measurements
Safely measuring large currents in a laboratory or production setting presents many challenges not associated with typical signal acquisition. Learn how to measure current using transformers, transducers, and data acquisition devices. See how to use current measurements as part of a power quality analysis or power monitoring system. Read the white paper.
Find The Right Medical Adhesive
Master Bond's latest white paper addresses five basic questions developed in-house to enable engineers to make a more educated choice when looking for the ideal medical adhesive for their application. Each question is a step towards choosing materials and adhesives that not only work together as a system, but also minimize trade-offs between performance and manufacturability.
Epoxies Safeguard Medical Electronic Devices
The combination of increasingly complex assemblies and exacting quality requirements is compelling design engineers to be extremely diligent when selecting materials for the assembly of medical electronic devices.In this white paper, we explore various polymer chemistries and what the different families of compounds have to offer for performance and processing requirements.
Advanced Light Cure Adhesives
Breakthroughs in adhesive technology enable light curing adhesives to cure under a visible light wavelength of 405 nanometers. Learn how these environmentally friendly adhesives can improve worker safety and lower production costs while offering a range of desirable engineering properties ideal for many applications.
Adhesives for the Medical Industry Catalog
For an overview of our most popular medical grade epoxies, please browse this easy to read catalog organized by chemistry, key properties and curing schedules.
Adhesives, Sealants and Coatings for the Electronic Industry
Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit board, semiconductors, microelectronics, and more. Browse our catalog to find out more.
Capturing the Big Data Explosion
This paper will discuss how this year marks an inflection point when Big Data opportunities will move into mainstream use across a broad range of markets including automation, energy distribution, retail, healthcare, and more.
Supercomputer Technology Reports for Duty
In this article we will examine the features of the new processor and show how they can be used for HPEC.
Understanding a Key Trend in Embedded System Design
As embedded applications grow in complexity, hardware architectures and embedded system design tools must evolve to address increasingly demanding requirements and minimize design time. System designers are migrating to computing architectures featuring multiple distinct processing elements, heterogeneous architectures, to provide a more optimal balance between throughput, latency, flexibility, cost, and other factors. Learn more about this key trend in embedded systems design.
IBM Rational targets engineering lifecycle management (Ovum)
Rational Engineering Lifecycle Manager (RELM), is a promising first step for generating views of the product lifecycle, venturing beyond data integration to help stakeholders cut through the complexity of what is currently a highly siloed process.
Improving Design Reliability by Avoiding EOS
With the advent of more complex design requirements and greater variability in operating environments, electrical overstress (EOS) is one of the leading causes of IC failures across all semiconductor manufacturers, and is responsible for the vast majority of device failures and product returns. Learn how Calibre PERC can help you:
  • Understand voltages at the pin level without SPICE simulation
  • Avoid EOS and identify oxide-breakdown conditions
  • Improve reliability and reduce verification time
Reduce Verification Complexity in Low/Multi-Power Designs
Verification requirements are growing in all market segments. Ensuring these requirements are met requires design verification that goes beyond traditional design rule checking (DRC), layout vs. schematic (LVS) comparison, and electrical rule checking (ERC). Small and large process nodes alike are affected by these requirements, while both system-on-chip (SoC) and full custom designs also need comprehensive reliability coverage. Learn how Calibre PERC can help you:
  • Understand the interactions between different power domains
  • Ensure signals and voltage domains are protected for all operating conditions
  • Get easy-to-use, unambiguous debug results without exhaustive test vectors
Transitioning from RoHS to RoHS2: The current state of RoHS in the Electronics Industry
This paper examines the differences between European RoHS and RoHS2, provides advice for a successful transition, and explores the potential impact the transition will have on electronics manufacturers.
Gaseous vs. Diesel Fuel Gensets
Power density and capital cost advantages have favored diesel fuel for standby power of 150kW or more. However, technological innovations coupled with diesel fuel storage and reliability concerns are making gaseous-fueled generators more attractive in large commercial and industrial applications.
CIC Guide: Agile Deployment For Embedded Software & Complex Systems
Agile is a cornerstone of software delivery from IT to complex and embedded systems. This research-based paper reports on key challenges, patterns and working practices for extending Agile to cross-discipline deployment in product and systems development.
Cutting Risk And Rework Through Requirements-Driven Quality In Complex And Embedded Systems Development
In this webcast, IBM expert Ed Mayer looks at new capabilities within the Rational solution for systems and software engineering to link requirements and testing, helping development teams to easily build traceability, simplify impact and coverage analysis, and effectively manage defect resolution.
How To Capture The Hidden Value Within Your Engineering Data
Learn how you can visualize, analyze, and organize the value hidden within your complex web of engineering data—helping you more efficiently define, design, and validate smarter products.
Managing Systems Design Complexity: 3 Tips To Save Time
This report examines the challenges presented by the increasing quantity and complexity of embedded software in smarter products. It describes the key practices adopted by best-in-class development organizations to address those challenges.
Systems Engineering: The Key To Optimizing Business Value In Product Development
Systems engineering can help reduce the risk of change to both product and development processes, provide insight into the impact of design decisions early on, and ensure that the product built is optimized for the business.
10 Reasons Why Multi-Material 3D Printing is Better for Your Product Design & Development
Based on their innovative use of inkjet printing technology, Objet 3D printers from Stratasys are the only additive layer manufacturing devices in the world able to combine different 3D printing materials within a single 3D printed model.
Green eMotion
The European Union supports research and demonstration of road transportation solutions that have potential to achieve a breakthrough in the use of renewable energy sources. The project Green eMotion was selected to enable a mass deployment of electromobility in Europe. Forty-two partners from industry, the energy sector, electric vehicles manufacturers, municipalities as well as universities and research institutions have joined forces in the Green eMotion project.
Ditch the Documents and Spreadsheets - Manage Requirements Efficiently and More Accurately with IBM Rational DOORS Next Generation
Using productivity tools for requirements management is like using a hammer to open a bottle. It gets the job done, but at what cost? IBM Rational DOORS NG offers effective requirements management capabilities by including the ability to capture relationships and manage dependencies.
IBM Rational Automotive Engineering Solution ekit
Organizations in the automotive industry face increasing engineering related challenges due to market needs requiring vehicles to be smarter, intelligent, instrumented and interconnected more than ever before. This resource center includes materials which address those challenges and describe the benefits of the IBM Rational Solution for Automotive Engineering.
Agile Development — Why Requirements Matter
This paper argues that requirements management can bring significant value to agile development in regulated IT and complex product development projects, and sets out the characteristics of an effective requirements management approach in an agile environment.
Intelligent PLCs Expand the Internet
In this article we will review the features and benefits of the Intel Atom processor E3800 product family. We will then examine off-the-shelf solutions from the Intel® Intelligent Systems Alliance. From modular components to market-ready industrial systems, Intel and the 250+ global member companies of the Alliance provide the performance, connectivity, energy efficiency, manageability, and security developers need to create smart, connected systems. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market factory automation solutions to improve manufacturing efficiency.
Flexible Design with Small Boards
Industrial IoT equipment needs speed and flexibility without sacrificing power or space. Find out how Alliance boards based on the Intel® Atom™ processor E3800 product family meet the challenge.
A New Mindset in Product Design
New Mindset in Product Design – 3D printing can accelerate the design process, improve designs and cut costs. Read how 3D printing provides a highly cost-efficient means of producing numerous design iterations quickly to reduce your time-to-market while improving the overall design of your products, allowing you to maintain a competitive edge in the marketplace.
Overcome Challenges of Your Highly Constrained PCB Design with PADS
Layout constraints are an essential part of a PCB design. As the technology in modern electronic devices has become more complex (e.g. increasing speed, decreasing rise time and supply voltage values), signal integrity issues have become a primary concern. For many designs, this means a large percentage of nets require PCB layout constraints to meet signal integrity requirements. This brings two major challenges: creating a proper set of layout constraints for your design and applying those constraints during the PCB layout design process. This paper shows how PADS helps address the challenges of highly constrained designs.
Removing the Gap Between ECAD and MCAD Design
PADS® EDMD collaboration brings the desktop PCB design industry a real-time integrated ECAD-MCAD collaboration environment that enables Electrical and Mechanical design teams to work together throughout the entire design process. Read this paper to learn more about how this collaboration can benefit your team.
Podcast: What's new from IBM Rational for Smarter Product Development?
In this podcast Jon Chard, marketing manager for IBM Rational Smarter Product Development discusses the key challenges and how Rational is continuing to deliver on its strategy of an open, connected, systems approach to Smarter Product Development.
Webcast: Stop Re-Inventing the Wheel - Secrets to Practical Software Reuse
This webinar will look at the keys to improving reuse of software across a family of software intensive systems, including how to effectively share the same software, reuse proven software components, and manage delivery of software reused across multiple products.
PLEXOS® Integrated Energy Modelling around the Globe
PLEXOS® Integrated Energy Modelling is an advanced software tool that employs the latest mathematical programming methods and it can provide specific answers needed to some of the most challenging questions that the Global Energy Markets are facing today. It can provide significant insights on new Power & Gas Markets' Policies implementation, while at the same time, with its state of the art Stochastic Modelling & Optimisation abilities, it can effectively manage and cope with the associated uncertainties. This paper presents an overview of these Global Energy Markets challenges, as well as the associated real world applications and capacities of PLEXOS®.
Maximize PCB Power and Efficiency with Best Practice Placement and Routing
Some of the most time-consuming tasks in PCB design are placing parts on the board and routing traces. Designers who complete these tasks efficiently can make a more positive and direct impact on design quality and development time than designers who do not. PADS (personal automated design system) offers outstanding placement and routing capabilities that reduce the design cycle and improve product quality.
Mastering the Magic of Multi-Patterning
Multi-patterning technology was introduced at the 20 nm node to overcome lithographic limitations in current IC manufacturing processes. While processes like double and triple patterning may sometimes seem like magic, successfully implementing multi-patterning compliance in the IC design and verification flow requires a thorough understanding of multi-patterning techniques and their impact on your design. Learn what multi-patterning is, why you need it, and how Calibre® Multi-Patterning software can help you effectively and efficiently incorporate multi-patterning into your leading-edge designs.
Precision Prototyping: The Role of 3D Printed Molds in the Injection Molding Industry
PolyJet 3D printed molds allow manufacturers to take functional testing to a new level by creating product prototypes from the same injection molding process and materials that will be used to create their final product. As a result, they can easily evaluate the performance, fit and quality of potential products before mass production starts. To learn more about how 3D printing is changing the injection molding industry download this white paper.
Reducing the risk of development failure with cost-effective capture and management of requirements
In this whitepaper, a leading analyst provides his analysis and thoughts on the discipline of requirements management; discusses how it continues to play a role in satisfying the emerging focus on regulatory requirements.
Systems Engineering Best Practice: Model-based requirement analysis
This is a paper on model based requirements analysis where best practices in using modeling for requirements analysis and how that links with requirements management is discussed.
Knoq Your TCO: A look at Medium Voltage VFDs
Medium voltage variable frequency drives (MV VFD) are high consideration, high cost assets engineers are incorporating more and more into manufacturing process. There are plenty of benefits these drives afford, such as energy efficiency and process control. However, being able to quantify these benefits between manufacturers of MV VFDs challenges engineers to identify which solution is the most affordable and reaps the greatest rewards. Drive manufacturers range wildly in price, efficiency, life cycle and reliability. In this white paper, we analyze what factors contribute to TCO (total cost of ownership) of a drive, how to calculate the NPV (net present value), explain the inverse relationship between reliability and TCO and how longevity of product and customer service and support affect TCO.

When manufacturing plants are looking to upgrade assets and equipment, everything is judged from a bottom-line approach. Plant managers are challenged to find equipment which marries affordable and long-lasting, in order to meet the goals of corporate initiatives and project budgets. It is vital to your success and your company’s profitability that you know your TCO.
Specialized Adhesives Withstand Thermal Cycling
Thermal cycling can create stresses on bonded parts that fluctuate vastly between different temperatures, from extreme cold to extreme heat, during regular intervals or on an intermittent basis. Adhesives have a proven track record for thermal applications. Learn more about their functional benefits and what to consider when choosing an adhesive for use in thermal cycling applications.
Conformal Coatings for Reliable Electronic Assemblies
Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.
Protecting Chip on Board (COB) Devices with Glob Top Encapsulants
Glob top encapsulations are often preferred for their ability to protect chips without damaging fragile wires. They are formulated to exhibit specific physical properties such as electrical insulation, resistance to moisture and chemicals and thermal conductivity, to name a few. These encapsulants play a critical role in the successful manufacturer of many common consumer and industrial devices.
Building smarter products with product development capabilities from IBM
This guide introduces IBM's vision for designing, delivering and managing smarter products, called insight and product innovation, including the key capabilities of business planning and transformation, product and systems development, product support, and lifecycle collaboration.
Creating smarter products with IBM Rational systems and software engineering (Building a Smarter World)
Systems engineering and software development are key disciplines for helping companies innovate, leading to an increased ability to compete in a smarter world. This ebook describes how to meet the challenges of complex product and software development. Learn about Rational capabilities for systems engineering and real-time and embedded software development.
Engineering Change to Accelerate Product & Systems Development (WP)
In this paper, VDC Research reviews their research results and recommendations on the changes and challenges that are driving a growing need for lifecycle management tools that can facilitate higher levels of collaboration and integration across the development lifecycle.
Model-based systems engineering: Revolution or evolution?
This whitepaper traces the evolution of Model Based Systems Engineering (MBSE), a structured and visual approach for collaborative systems design and development which facilitates early validation of requirements, architectural trade off analysis and mitigation of project risks.
Improve Reliability with Accurate Voltage-Aware DRC
Power challenges in today's IC designs create a significant increase in verification complexity. Critical design rule checking of variable spacing rules for densely packed multi-voltage nets is often verified with the traditional use of marker layers, a tedious and error-prone technique. Without an efficient means of verifying variable spacing within nets, designers often play it safe and simply apply maximum spacing throughout specific areas of a design, wasting valuable design area. Learn how to:
  • Optimize design size with correct voltage spacing rules
  • Avoid TDDB within your designs
  • Improve reliability and free yourself from manual marker layers
Ten Point Guide To Improving Real-Time And Embedded Software Development
Software plays an ever-increasing role in driving innovation and providing marketplace differentiation in "smarter" products. However, the complexity of bringing more interconnected, instrumented and intelligent products to market faster is stretching traditional software development approaches to the limit. Join the webcast to learn key strategies to address these challenges.
Ten Point Guide To Streamlining Product Development With Systems Engineering
Systems engineering can help engineers see the big picture-- not just their small piece of the puzzle-- with the benefits of faster development, higher product quality, increased innovation and reduced risk. Attend this informal coffee-break style discussion and learn ten key ways that systems engineering can help streamline product development.
The Systems Development Journey Of Smart Products
Smart products involve complex systems of interconnected software, electrical, and mechanical components. Among Best-in-Class performers, smart products helped drive a 9% increase in new product profit margins requiring the adoption of a systems engineering approach to product development
Three Imperatives For Advancing Product And Systems Development
Organizations developing products and systems in industries such as automotive, aerospace and defense, medical devices and consumer electronics are undergoing a transformation driven by the rapid growth in functionality delivered by software and electronics. This paper outlines an approach for using this shift to gain a competitive advantage.
Three Reasons To Throw Away Your Requirements Documents
In this webcast, Andy Gurd, a Senior Go-To-Market Manager with IBM puts forth the case of why companies should move away from documents and spreadsheets for requirements management, what are the business benefits of investing in an integrated requirements management solution and the best practices for managing your requirements effectively and efficiently. Andy will also touch base on how Rational DOORS Next Generation - the latest requirements management solution for complex and embedded systems from IBM helps in achieving the thoughts discussed in the webcast.
Flip Chip Assemblies with Underfill Encapsulants
The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.
How To Simplify and Improve Fastening in Medical Devices
Modern adhesives offer medical device engineers a leg up with new options to simplify fastening and improve performance as medical devices and materials continue to advance. When faced with often hostile environments of human bodies and hospitals, modern, well-designed structural medical adhesive compounds can be used safely for disposable and reusable medical devices. Master Bond's white paper explores the advantages of various adhesive chemistries, their properties and features.
Clearly Superior Epoxies for Optical Applications
As technology in the optics industry continues to advance and improve, careful consideration of the properties of epoxies must be evaluated. When determining the most effective adhesive to be used in opto-electronics, medical and other optic related industry applications, trade-offs of key characteristics should be assessed. Here is a guide to the different properties to consider, their benefits and potential disadvantages and advice on how to prioritize these factors for the success of the application.
Five benefits of agile practices in software-intensive systems development
By adopting agile planning and management solutions alongside existing tooling investments for change and configuration management, teams can transform their delivery processes while helping to minimize investment cost and implementation risk. This paper addresses five key business benefits in moving to agile practices.
Introducing the next generation tool for managing requirements in complex systems - IBM Rational DOORS Next Generation
Learn from an IBM Requirements Management expert as he discusses the evolution of DOORS, its capabilities and how it can enhance your efforts in managing requirements effectively and developing complex systems. The interoperability capabilities of DOORS NG with DOORS 9 and future development efforts for DOORS 9 are also covered.
New approaches to Systems Engineering and Embedded Software Development
IBM experts on embedded systems development lifecycle management solutions discuss new approaches in developing advanced products and systems. Topics include systems engineering, quality and requirements management, and industry specific compliance.
Rationalizing the software development lifecycle in systems engineering (Ovum)
Software is changing the nature of products and also the nature of systems engineering. Across many product industry sectors, software is arguably driving most innovation. For many product engineering organizations, the growth of software content raises the urgency to ingrain systems engineering mentality and practice across all engineering teams.
Seven steps to achieving better requirements engineering in your organization
Companies that successfully introduce a new requirements engineering process not only change their process and technology, but also change their thinking. While improving your requirements management and analysis practices, this step-by-step guide can help you accelerate change and process acceptance across your organization.
Smarter product development needs effective systems engineering: Get greater visibility across your systems engineering data
An Ovum analyst elaborates on the challenges in development of the next generation of smarter products, the importance of systems engineering and the need for a new approach to gaining visibility of engineering data across tools.
The Ten Point Guide to Improving Real-time and Embedded Software Development
This guide offers key tips to help companies meet the challenge of delivering software-driven innovation in smart products. Tech-Clarity offers ten tips to help companies combat complexity and streamline embedded software development.
Transforming change into a competitive advantage
This paper provides an overview of new approaches, tools and solutions for global collaboration throughout the development lifecycle can help you effectively manage change and complexity in the development of smarter products.
Multiphysics Simulation Software
The fusion of faster hardware and smarter algorithms opens up entirely new opportunities for multiphysics modeling and simulation of the real world.
Four Key Elements to Improving Systems Engineering in Aerospace and Defense
This white paper explores four key ways in which A&D companies can improve SE and looks at IBMRational®solutions and approaches that can help organizations deliver quality products on time and within budget, while increasing efficiency and improving collaboration.
Systems Engineering For Dummies
Systems Engineering For Dummies, IBM Limited Edition, explains what systems engineering is and how it can help you harness the complexity inherent in developing smart, connected products. If you're looking for ways to expedite time-to-market, ensure business agility, and deliver high-quality smart products while cutting costs, Systems Engineering For Dummies, IBM Limited Edition, is the book for you.
Wizardry at your fingertips--Making tough decisions easier with predictive analytics
Join this webcast to learn how IBM Rational Rhapsody uses a state-machine based model to create executable system models to help engineers manage complexity and understand system behaviour early in the product development lifecycle. IBM Rational Focal Point uses a decision/prioritisation model to assist users to do portfolio analysis IBM Investment Analyst, a plug-in for Focal Point, encapsulates probability distribution mathematics to present a prediction of future value based on actual past and present data, and on future, options-based reasoning about future value.
Applying agile principles to the development of smarter products
Agile development has become a cornerstone of most software development organizations. Marked by iterative processes that deliver incremental value over time, agile development has enabled organizations to manage software complexity more effectively and to improve quality and time to market compared with previous development processes.
Adopting agile while protecting your strategic investments
The transition to agile can elevate the entire software development process, improving quality, increasing transparency and collaboration and speeding time to market. With IBM Rational Team Concert, this transition can be fluid, simple and highly cost-effective.
Adopting agile methods for safety-critical systems development (WP)
Because of the discipline and efficiency that agile brings to development, agile can be - and is - applied to the development of safety critical systems. This paper discusses how agile methods can be used to deliver high quality results with improved predictability.
Accelerating innovation: New approaches to software development for smarter products
This white paper examines software delivery for smart products and strategies for evolving software development into a business process. Agile development has enabled organizations to manage software complexity more effectively and to improve quality and time to market.
Epoxy Innovations Drive Adhesive Bonding Growth
Whereas once mechanical fasteners may have been the assembly option of choice, tremendous strides in polymer chemistry over the past few decades have made epoxy resins technically and economically superior. In this white paper, we explore the various performance characteristics of adhesive technologies and their use in modern applications across many industries.
NI's Control Design Guide for Next-Generation Machines
Learn about essential technologies for the design of smart machines, from common architectures for distributed machine control systems to motion vision integration to advanced control strategies.
Enhancing the Long-Term Reliability of Electronic Assemblies with Conformal Coatings
Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.
Understanding and addressing risk in systems and software delivery
In this paper, IBM proposes that organizations relying on the traditional waterfall process for systems and software delivery—that is, an engineering governance model—need to make changes to reduce risk and improve results. Although engineering governance once worked when time frames were longer, budgets more generous and projects less complicated, we argue that it is proving largely ineffective today. IBM proposes adoption of agile delivery practices—that is, an economic governance model—for attaining significant improvements.
A Framework for the Internet of Things
The Internet of Things is transforming our lives, changing everything from how we shop to how we stay healthy. This move to a smarter, connected world is revamping embedded development, affecting every industry – from manufacturing to telecom. Learn how you can participate in this transformation.
A Software Strategy for the Evolved Packet Core (EPC)
As an all-IP network, the EPC can be implemented using commodity server hardware. This enables a virtualized packet core, where different workloads can be deployed on a common set of hardware for greater flexibility and scalability.